A 3D-printed chimney stack dropped CPU temperatures by 19°C with zero active cooling. Der8auer's recent video tests the stack effect, the thermodynamic principle where hot air rising through a vertical tube creates negative pressure that draws more air upward, applied directly to a water-cooled PC radiator.
The experiment is methodical, not a one-shot result. A single printed funnel segment produces a measurable temperature drop. A second segment creates visible airflow, confirmed with a smoke machine. The full stack delivers the 19°C figure. The progression matters: it shows the effect scales predictably, which is the detail worth reading for.
The principle is not new. Apple's passively cooled Power Mac G4 Cube used it. SilverStone built it into the Raven RV02 by rotating the entire case 90 degrees. What der8auer adds is quantified, reproducible data on how tall the chimney needs to be before diminishing returns make the enclosure impractical. That tradeoff is the real story here.
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